题目内容

A large crystalline silicon module consists of 72 cells. The open-circuit voltage of the module is 21.6 V. How are the cells connected in the module if the standard c-Si cell has an open circuit voltage of 0.6 V and short-circuit current of 3 A ?

All 72 cells in parallel to each other.
B. Two strings, each string consisting of 36 cells connected in parallel. Both these strings are connected to each other in series.
C. Two strings, each string consisting of 36 cells connected in series. Both these strings are connected to each other in parallel.
D. All 72 cells in series with each other.

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Consider the following statements concerned with interconnecting solar cells to make a solar module. Which of the statements is false?

A. The open-circuit voltage of a solar module with series connected solar cells is the sum of the open-circuit voltages of all the individual solar cells.
B. The short-circuit current of a solar module with series connected solar cells is the sum of the short-circuit currents of all the individual solar cells.
C. The use of bypass diodes in a solar module can help in reducing the undesired effects of a dysfunctional solar cell. The bypass diode is connected in parallel to a solar cell but with a polarity opposite to that of the solar cell.

What is NOT true about the thermal oxide layer?

A thermal oxide layer can serve as a passivation layer.
B. A thermal oxide layer acts as an insulator and forces the electrons to flow in the emitter.
C. It creates a back surface field at the back side of the solar cell and thus it reduces the surface recombination velocity.
D. The oxide layer can be thermally grown.

Which of the following concepts are used in the PERL (Passivated Emitter Rear Locally diffused) solar cell?Note that more than one correct answer is possible.

A. Inverted pyramids
B. Multi-junctions
C. Bifacial configuration
D. Photolithographic fabrication of front metal grid

Which of the following statements is false?

A. Increasing the length of the finger increases the resistive losses.
B. Increasing the finger spacing decreases the power losses due to shadow.
C. Increasing the finger width increases the power losses due to shadow.
D. Increasing the finger width increases the resistive losses.

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